#0 (
0%) - hi-tehnology.ru
0%) - hi-tehnology.ruTitle: Новости hi-tech » Новостной блог
Description: Техника оригами позволяет создавать трехмерные микроустройства, Вконтакте и успеваемость несовместимы, Системная плата MSI Eclipse Plus с подде
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#9,154,890 (0%) - zumro.com
0%) - zumro.comTitle: Zumro, Inc :: The Right Choice for all Emergency Services
Description: Not available
+Title: SiTime, Silicon MEMS Oscillators and Clock Generators
Description: SiTime Corporation, an analog semiconductor company, offers MEMS-based silicon timing solutions that replace legacy quartz products. With 85% market share and over 50 million devices shipped, SiTime is driving the 5 Billion timing market’s transition t
#9,311,971 (0%) - apogeemems.com
0%) - apogeemems.comTitle: Apogee Technology, Inc.
Description: Apogee is a biotechnology company developing novel drug delivery systems and health sensing solutions to address unmet market health needs.
Keywords:Sensors, Microsensor, Microneedle, Microfluidic, Nanostructures, NEMS, Bio Sensor, Pressure Sensors, PRT, Drug Delivery, manufacturing, Micro Electro Mechanical Systems, MEMS-Development, PyraDerm, buried cavity, Sensilica, gas, polymer, encapsulation, TDD, transdermal drug delivery, large molecule, protein, peptide, low-solubility,
... (View More)
#0 (0%) - sstinternational.com
0%) - sstinternational.comTitle: SST International-Home Page
Description: SST International, World Leader in Package Assembly, supplies turnkey solutions for soldering, brazing and glass sealing of microelectronic packages and components.
Keywords:SST-International, vacuum-solder, vacuum-soldering, microelectronics, wafer-bonding, turnkey-equipment solutions, component brazing, MEMS, MEMS-packaging, process-development, hybrids, power-devices, high-temperature, high-vacuum package sealing, precision graphite machining, void-free, flux-free, lead-free, fiber-optic package soldering, eutectic die-bonding, vacuum, soldering, brazing, glass-sealing, glass-to-metal,
... (View More)
sealing, die-attach, eutectic, fluxless, scientific-sealing-technology, DAP-sealer, DIX-sealer, BGA, solder-ball-bumping, annealing, pressure-variation, getter-activation, hermetic-package-sealing, reflow, vacuum-furnace, vacuum-oven, graphite-tooling, graphite-fixture, inert-gas furnace, anodic-bonding, glass-frit, low-moisture, chip-scale, flip-chip, wafer-bump(View Less)
